【预订】Packaging Design 9783037681398 美国库房发货，通常付款后3-5周到货！

¥411.00

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CHRIS VAN UFFELEN /2013-05-28 /Braun

Packaging Design Packaging Design: Successful Product Brandi 现货图书

¥580.00

中国进口图书旗舰店

3条评论

Klimchuk, Marianne Rosner /2013-01-14 /Wiley

New Packaging Design 9781856696135

Product Details 基本信息 ISBN-13 书号 9781856696135 Author 作者 Kirkpatrick Format 版本 平装-胶订 Pages Number 页数 192页 Publisher 出版社 Laurence King Publication Date 出版日期 2009-09-21 Product Dimensions 商品尺寸 11.30 x 9.30 x 0.70 Shipping Weight 商品重量 2.45 Language 语种 其它（含多语） Book Contents 内容简介 Packaging today needs to do so much more than preserving, protecting, and promoting the products it contains. Therise of environmental issues and globalization mean that today's packaging designers must create innovative solutions that are also sustainable. This book shows how packaging design has changed to meet the demands of this new context. It takes the reader behind some of the worlds best-known brands to meet the designers, clients, marketers, technologists, environmentalists, and retailers, to tell their stories about

¥252.00

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Kirkpatrick /2009-09-21 /Laurence King

预订 Packaging Design 预订商品

¥252.00

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Carla C. Johnson: Janet B. Walton: Erin /2018-12-30 /National Science Tea

预订 Packaging Design, Grade 6 [ISBN:9781681404523] 【全球购】进口原版图书，一般5-8周左右到国内后发出

¥388.00

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Johnson, Carla /2018-07-01 /National Science Teachers Association

预订 Packaging Design: Successful Product Branding from Concep 【全球购】进口原版，预计10-12周左右到国内

¥839.00

书之源外文图书

Klimchuk, Marianne R. /2013-01-14 /Wiley

【3-6周达】Packaging Design [ISBN:9783037681398] 【全球购】进口原版图书，一般3-6周左右到国内

¥506.00

书之源外文图书

Van Uffelen, Chris /2013-06-16 /Braun Publishing

WHAT IS PACKAGING DESIGN 什么是包装设计 书籍非全新，8-99成新左右(实拍图以图片为准发货)

¥42.50定价：¥43.50 (9.78折)

书海寻梦图书专营店

如图 /2010-01-01 /如图

【中商原版】Managing Packaging Design For Sustainable Development 食品工业DanielHellstr?m

¥970.00

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Daniel Hellstr?m /2017-01-16 /Wiley

【预售 按需印刷】Innovative Packaging Design for Fast Movi 北京发货，付款后10天内发货

¥786.00

中图图书旗舰店

Gísli Thorsteinsson /2010-07-13 /KS OmniScriptum Publishing

【预订】Managing Packaging Design for Sustainable Development - 美国库房发货，通常付款后3-5周到货！

¥1124

中国进口图书旗舰店

Daniel Hellstrm /2016-11-22 /Wiley-Blackwell

正版书籍 包装设计一体化 专著 Packaging design integration 周功扬主编 eng bao z 正版图书支持发票 七天无理由退货让您购物无忧

¥27.00定价：¥45.00 (6折)

书海图书专营店

周功扬 编 /2021-07-01 /浙江工商大学出版社

Unpack Me! - New Packaging Design 打开我的包装！：新包装设计 艺术平面包装设计素材作品 正版可开发票 请联系在线当当客服

¥128.85定价：¥280.00 (4.61折)

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Sandu三度 /2013-09-24 /Sandu三度

【现货】【T＆H】Material Innovation: Packaging Design材料革新：包装设计 现货图书24小时发货

¥151.00

善本图书旗舰店

3条评论

无 /2007-06-01 /Thames & Hudson

【现货】【翰德图书】Material Innovation: Packaging Design 材料革新：包装设计 Le 现货图书24小时发货

¥161.75

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Andrew H. Dent and Leslie Sherr /2015-09-28 /Thames & Hudson

Material Innovation Packaging Design

¥214.00

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Andrew H. Dent and Leslie Sherr /2015-09-28 /Thames & Hudson

【3-6周达】Material Innovation: Packaging Design [ISBN:978050029 【全球购】进口原版图书，一般3-6周左右到国内

¥307.00

书之源外文图书

Dent, Andrew H.; Sherr, Leslie /2015-10-26 /Thames & Hudson

【3-6周达】Interactive Packaging Design [ISBN:9781912268535] 【全球购】进口原版图书，一般3-6周左右到国内

¥360.00

书之源外文图书

Chong,Peng /2018-09-01 /Design Media Publishing Ltd

海外直订The Importance of Packaging Design for the Chemistry of

¥589.00

中华商务进口图书旗舰店

Brunazzi, Giovanni /2014-07-24 /Springer

【预订】The Importance of Packaging Design for the Chemistry of 美国库房发货，通常付款后3-5周到货！

Product Details 基本信息 ISBN-13 书号 9783319084510 Author 作者 Brunazzi Format 版本 平装-胶订 Pages Number 页数 119页 Publisher 出版社 Springer International Publishing Publication Date 出版日期 2014-07-25 Product Dimensions 商品尺寸 9.2 x 6.1 x 0.2 cm Shipping Weight 商品重量 209g Language 语种 英语 Book Contents 内容简介 This Brief defines reliable correlations between the food packaging design and its chemical features in terms of an ’integrated food product’ (the synergistic union composed of the edible content and its container). A good design, as described in this Brief, implies the best choices from a series of possibilities, taking into account economical and commercial influences or limitations in the production and processing chain and the chemical interactions that can arise between the food containers and the contained edible material. This Brief highlights how the d

¥548.00

中国进口图书旗舰店

Brunazzi /2014-07-25 /Springer International Publishing

海外直订A Novel Vacuum Packaging Design Process for Microelectro

¥604.00

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Research Laboratory, U. S. Army /2017-01-25 /Createspace Independent Publishing Platform

【3-6周达】The Importance of Packaging Design for the Chemistry 【全球购】进口原版图书，一般3-6周左右到国内

¥585.00

书之源外文图书

Brunazzi, Giovanni /2014-07-25 /Springer

3-6周达 包装设计决策:技术指南Packaging Design Decisions: A Technical Gui 【全球购】进口原版图书，一般3-6周左右到国内后发出

¥1187

书之源外文图书

Edited by: Roland Ten Klooster /2019-01-01 /DEStech Publications,Inc

【预订】Handbook of Electronics Packaging Design and Engineering 美国库房发货，通常付款后3-5周到货！

¥548.00

中国进口图书旗舰店

McGovern, Casey /2012-03-01 /暂无出版社信息

【3-6周达】Unpack Me!: New Packaging Design [ISBN:9788492810932] 【全球购】进口原版图书，一般3-6周左右到国内

¥591.00

书之源外文图书

Shaoqiang, Wang /2013-12-03 /Promopress

物化到人化:儿童商品包装人性化设计:research on humanity children supplies pac 新华书店，电子发票，多仓就近发货

¥9.50定价：¥35.00 (2.72折)

辽宁出版集团图书专营店

戴雪红编著 /2012-12-01 /江苏大学出版社

物化到人化:儿童商品包装人性化设计:research on humanity children supplies pac 新华书店 正版全新书籍 正规发票 多仓就近发货 85%城市次日送达！

¥11.30定价：¥35.00 (3.23折)

北方图书城旗舰店

戴雪红编著 /2012-12-01 /江苏大学出版社

物化到人化:儿童商品包装人化设计:research on humanit cilren supplies packagi

¥35.00定价：¥35.00

名州图书专营店

2012-12-01 /江苏大学出版社

预订 For Sale: Over 200 Innovative Solutions in Packaging Desi 【全球购】进口原版图书，一般5-8周左右到国内后发出

¥336.00

书之源外文图书

Foster, John /2000-01-01 /How Books

【3-6周达】Boxed and Labelled Two!: New Approaches to Packaging 【全球购】进口原版图书，一般3-6周左右到国内

¥673.00

书之源外文图书

Klanten, Robert /2011-09-21 /Gestalten

3-6周达 管理可持续发展的食品包装设计：战略方向指南针 Managing Packaging Design For S 【全球购】进口原版图书，预计3-6周左右到国内

¥958.00

书之源外文图书

Daniel Hellstr?m /2016-11-22 /Wiley

【3-6周达】Handbook of Electronics Packaging Design and Engineer 【全球购】进口原版图书，一般3-6周左右到国内

¥585.00

书之源外文图书

Matisoff,Bernard S. /2012-03-07 /Springer

预订 Handbook Of Electronics Packaging Design and Engineering: 国外库房发货，通常付款后3-5周到货

¥548.00

中国进口图书旗舰店

Matisoff /2012-03-07 /Springer

【3-6周达】Handbook of Electronics Packaging Design and Engineer 【全球购】进口原版图书，一般3-6周左右到国内

¥585.00

书之源外文图书

Matisoff,Bernard S. /2012-03-01 /Springer

海外直订Handbook of Electronics Packaging Design and Engineering

¥553.00

中华商务进口图书旗舰店

Matisoff, Bernard S. /2012-03-01 /Springer

预订 Delicious Colour: Food Packaging Design [ISBN:97898877705 【全球购】进口原版图书，一般5-8周左右到国内

¥473.00

书之源外文图书

Designerbooks /2017-01-01 /Designer Books

预订 Wrap It Up: Creative Structural Packaging Design. Include 【全球购】进口原版图书，一般5-8周左右到国内后发出

¥510.00

书之源外文图书

Shaoqiang,Wang /2021-07-06 /Hoaki

【中商原版】Japan Unboxed: Contemporary Packaging Design in Japan

¥195.00

中华商务进口图书旗舰店

Counter-Print /2025-02-15 /Counter-Print

【预订】Structural Packaging: Design Your Own Boxes and 3/D Form 美国库房发货，通常付款后3-5周到货！

¥165.00

中国进口图书旗舰店

1条评论

PAUL JACKSON /2012-02-06 /Laurence King

海外直订Structural Packaging: Design Your Own Boxes and 3-D Form 海外发货，付款后预计2-4周到货

¥214.00

中华商务进口图书旗舰店

Jackson, Paul /2012-02-15 /Laurence King

【3-6周达】Structural Packaging: Design Your Own Boxes and 3-D F 【全球购】进口原版图书，一般3-6周左右到国内

¥295.00

书之源外文图书

Jackson, Paul /2012-02-15 /Laurence King

【3-6周达】Power Electronic Packaging: Design, Assembly Pr [ISBN 【全球购】进口原版图书，一般3-6周左右到国内

¥2732

书之源外文图书

Liu, Yong /2014-04-13 /Springer

【预订】Power Electronic Packaging: Design, Assembly Process, Re 美国库房发货，通常付款后3-5周到货！

¥2738

中国进口图书旗舰店

Liu, Yong /1988-08-08 /Springer

海外直订Power Electronic Packaging: Design, Assembly Process, Re

¥2429

中华商务进口图书旗舰店

Liu, Yong /2012-02-14 /Springer

【3-6周达】Power Electronic Packaging: Design, Assembly Process, 【全球购】进口原版图书，预计3-6周左右到国内

¥2320

书之源外文图书

Liu, Yong /2012-02-15 /Springer

海外直订Power Electronic Packaging: Design, Assembly Process, Re

¥2429

中华商务进口图书旗舰店

Liu, Yong /2014-04-12 /Springer

3-6周达 H-Point: The Fundamentals of Car Design & Packaging [I 【全球购】进口原版图书，一般3-6周左右到国内后发出

¥521.00

书之源外文图书

Macey, Stuart /2014-12-15 /Design Studio Press

现货 H-Point: The Fundamentals of Car Design & Packaging 97816

Product Details 基本信息 ISBN-13 书号 9781624650192 Author 作者 Macey Stuart Format 版本 平装-胶订 Pages Number 页数 287页 Publisher 出版社 Design Studio Press Publication Date 出版日期 2014-12-15 Product Dimensions 商品尺寸 8.50 x 11.00 x 0.80 Shipping Weight 商品重量 2.95 Language 语种 其它（含多语）

¥938.00

中国进口图书旗舰店

Macey Stuart /2014-12-15 /Design Studio Press

【3-6周达】Smoke Gets in Your Eyes: Branding and Design in Cigar 【全球购】进口原版图书，一般3-6周左右到国内

¥354.00

书之源外文图书

Thibodeau,Michael; Martin,Jana /2000-09-01 /Abbeville Press

海外直订Design and Technology of Packaging Decoration fo... 面向消费

¥1939

中华商务进口图书旗舰店

No /2000-12-31 /John Wiley and Sons Ltd

海外直订Packaging Sustainability: Tools, Systems and Strategies

¥457.00

中华商务进口图书旗舰店

2008-10-31 /Wiley

【3-6周达】Chiplet Design and Heterogeneous Integration Packagin 【全球购】进口原版图书，一般3-6周左右到国内

¥1395

书之源外文图书

Lau,John H. /2024-03-29 /Springer

Chiplet Design and Heterogeneous Integration Packaging 97898 现货图书

Product Details 基本信息 ISBN-13 书号 9789811999161 Author 作者 John H. Lau Format 版本 精装 Pages Number 页数 862页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-03-24 Language 语种 其它（含多语） Book Contents 内容简介 The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers,

¥2081

中国进口图书旗舰店

3条评论

John H. Lau /2023-03-24 /Springer Berlin Heidelberg

预订 Chiplet Design and Heterogeneous Integration Packaging 预订商品

¥1424

中国进口图书旗舰店

2024-03-28 /Springer Berlin Heid

预订 Co-Design and Modelling for Advanced Integration and Pack 【全球购】进口原版图书，一般5-8周左右到国内后发出

¥1367

书之源外文图书

Bailey, Christopher /2020-08-30 /World Scientific Publishing Company

【3-6周达】Chiplet Design and Heterogeneous Integration Packagin 【全球购】进口原版图书，一般3-6周左右到国内

¥1974

书之源外文图书

Lau,John H. /2023-03-11 /Springer

海外直订Package Design Workbook: The Art and Science of Successf

¥262.00

中华商务进口图书旗舰店

Dupuis, Steven /2011-05-31 /Rockport Publishers

先进电子封Modeling,Analysis,Design and Tests for Electronics Pack 先进电子封装的建模与分析

本书具有以下创新点：1.率先将多孔介质理论用于电子封装的热模拟分析，用于处理复杂的封装组件，如具有外绝缘层的TSV结构、微焊点和焊球阵列、具有多层结构和多种微通孔的基层，RDL层等，并应用于封装系统性能分析，可以有效解决封装热模拟仿真问题，大大缩短计算时间，并具有良好的模拟精度。 ?2. 持续研究了3D芯片堆叠封装的热性能极限。随着3D封装的发热量上升，单纯的自然对流或者冷板技术不能实现有效热管理，采用直接液冷技术、或者背部微槽道液冷才能大幅度提高热设计功率，从而实现更高的芯片性能。 ?3. 在新材料方面，作者引入碳纳米管作为3D互联TSV技术，分析其热性能和电性能，指出采用碳纳米管互联可以去除微焊点层，提高堆叠芯片之间的散热性能，从而缓解甚至消除热管理危机。同时，也对采用石墨烯、金刚石作为热扩散材料进行了

¥310.40定价：¥398.00 (7.8折)

30条评论

张恒运，车法星，林挺宇，赵文生 著 /2021-03-01 /化学工业出版社

电子封Modeling,Analysis,Design and Tests for Electronics Packag

¥371.00定价：¥398.00 (9.33折)

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化学工业出版社

先进电子封Modeling,Analysis,Design and Tests for Electronics Pack 【畅销品 假一罚十正版图书 请放心下单，本店所有商品均可开票】

¥398.00定价：¥398.00

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无 /化学工业出版社