Chiplet Design and Heterogeneous Integration Packaging 97898 现货图书

Product Details 基本信息 ISBN-13 书号 9789811999161 Author 作者 John H. Lau Format 版本 精装 Pages Number 页数 862页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-03-24 Language 语种 其它（含多语） Book Contents 内容简介 The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers,

¥2081

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John H. Lau /2023-03-24 /Springer Berlin Heidelberg

【3-6周达】Chiplet Design and Heterogeneous Integration Packagin 【全球购】进口原版图书，一般3-6周左右到国内

¥1395

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Lau,John H. /2024-03-29 /Springer

【3-6周达】Chiplet Design and Heterogeneous Integration Packagin 【全球购】进口原版图书，一般3-6周左右到国内

¥1974

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Lau,John H. /2023-03-11 /Springer

预订 Chiplet Design and Heterogeneous Integration Packaging 预订商品

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