预订 Flexible, Wearable, and Stretchable Electronics 英文原版 [ISB 【全球购】进口原版图书,约5-8周到达国内后发出
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预订The Undead King's Reign of Peace, Vol. 1 (light novel) 预订,预计下单后3-6周左右发货!
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【预订】3D Integration in VLSI Circuits: Implementation Technolo 国外库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9781032095547 Author 作者 Edited by Katsuyuki Sakuma Format 版本 平装-胶订 Pages Number 页数 217页 Publisher 出版社 CRC Press Publication Date 出版日期 2021-06-30 Language 语种 其它(含多语) Book Contents 内容简介 Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art informat
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海外直订3D Integration in VLSI Circuits: Implementation Technolo
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预订The Dirty Way to Destroy the Goddess's Heroes, Vol. 6 (lig 预订,预计下单后2-3周左右发货!
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按需印刷Flexible, Wearable, and Stretchable Electronics 预订,预计下单后3-4周左右发货!
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预订The Dirty Way to Destroy the Goddess's Heroes, Vol. 4 (lig 预订,预计下单后2-3周左右发货!
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预订 高被引The Plasticity of Skeletal Muscle: From Molecular Mech 【全球购】进口原版图书,约5-8周到达国内后发出
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【预订】3D Integration in VLSI Circuits 9781138710399 美国库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9781138710399 Author 作者 Edited by Katsuyuki Sakuma Format 版本 精装 Pages Number 页数 216页 Publication Date 出版日期 2018-05-10 Language 语种 英语 Book Contents 内容简介 In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs), monolithic 3D ICs; 3D heterogeneous integration; and 3D systems integration. Cell phone, laptops, and supercomputers are all examples of electronic devices that contain 3D integrated circuits. This book covers the latest technologies, including: design, chip/wafer level 3D integration technology, memory stacking, and reconfigurable 3D. Additionally, the text will include case studies from IMEC, CEA Leti, IBM, SK Hynix, and GLOBALFOUNDRIES. Chapters are written by R D researchers and developers from around the world.
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预订 高被引3D Integration in VLSI Circuits: Implementation Techno 【全球购】进口原版图书,约5-8周到达国内后发出
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预订 The Plasticity of Skeletal Muscle: From Molecular Mechani 【全球购】进口原版图书,约5-9周到达国内后发出
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【预订】The Plasticity of Skeletal Muscle 9789811032912 美国库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9789811032912 Author 作者 Sakuma, Kunihiro Format 版本 精装 Pages Number 页数 321页 Publisher 出版社 Springer Singapore Publication Date 出版日期 2017-02-15 Language 语种 英语 Book Contents 内容简介 This book discusses recent advances and various topics in plasticity of skeletal muscle from the perspectives of morphology, biological function, and clinical applications. Skeletal muscle is a highly plastic organ to adapt to environmental various demands, appears to endocrine various myokines, which flow into blood to protect the recognizing function of brain and inhibit the appearance of several cancer tumorigenesis.The book deals with current stem-cell based, pharmacological, and nutritional therapies for muscle wasting (sarcopenia, cachexia, and muscular dystrophy). It also explains the roles of biological mediators such as PGC-1, transient receptor potential cation channels (TRPC), and
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【预订】Computational Simulation in Architectural and Environmen 美国库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9784431563433 Author 作者 Tetsuya Sakuma The University of Tokyo Tokyo Japan Format 版本 平装-胶订 Pages Number 页数 324页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2016-09-17 Product Dimensions 商品尺寸 9.2 x 6.1 x 0.7 cm Shipping Weight 商品重量 522g Language 语种 英语 Book Contents 内容简介 This book reviews a variety of methods for wave-based acoustic simulation and recent applications to architectural and environmental acoustic problems.Following an introduction providing an overview of computational simulation of sound environment, the book is in two parts: four chapters on methods and four chapters on applications. The first part explains the fundamentals and advanced techniques for three popular methods, namely, the finite-difference time-domain method, the finite element method, and the boundary element met
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预订 高被引Computational Simulation in Architectural and Environm 【全球购】进口原版图书,约5-8周到达国内后发出
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预订Computational Simulation in Architectural and Environmenta 【全球购】进口原版图书,约5-8周到达国内后发出
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【预订】Computational Simulation in Architectural and Environmen 美国库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9784431544531 Author 作者 Sakuma Format 版本 精装 Pages Number 页数 324页 Publisher 出版社 Springer Japan Publication Date 出版日期 2014-08-13 Shipping Weight 商品重量 706g Language 语种 英语 Book Contents 内容简介 This book reviews a variety of methods for wave-based acoustic simulation and recent applications to architectural and environmental acoustic problems.Following an introduction providing an overview of computational simulation of sound environment, the book is in two parts: four chapters on methods and four chapters on applications. The first part explains the fundamentals and advanced techniques for three popular methods, namely, the finite-difference time-domain method, the finite element method, and the boundary element method, as well as alternative time-domain methods. The second part demonstrates various applications to room acoustics simula
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预订Medical Image Computing and Computer-Assisted Intervention 【全球购】进口原版图书,约5-8周到达国内后发出
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预订 高被引Basic Biology and Current Understanding of Skeletal Mu 【全球购】进口原版图书,约5-8周到达国内后发出
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海外直订医药图书Basic Biology and Current Understanding of Skeletal
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预订 Magnification Radiography [ISBN:9783642661228] 【全球购】进口原版图书,约5-8周到达国内后发出
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预售 按需印刷 Corporal Punishment 北京发货,付款后10天内发货
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预订 Grain Boundary Engineering in Ceramics: From Grain Bounda 【全球购】进口原版图书,约5-8周到达国内后发出
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【预订】Grain Boundary Engineering In Ceramics: From Grain 美国库房发货,通常付款后3-5周到货!
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【预订】Recent Advances in Nitric Oxide Research 美国库房发货,通常付款后3-5周到货!
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