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未来小趋势 (德)朗伽·尤格施瓦(Ranga Yogeshwar) 著 邱瑞晶 译 新华书店正版,关注店铺成为会员可享店铺专属优惠,团购客户请咨询在线客服!
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未来小趋势 (德)朗伽·尤格施瓦(Ranga Yogeshwar) 著 邱瑞晶 译 浙江人民出版社
¥32.30定价:¥55.00 (5.88折)
未来小趋势 浙江人民出版社 新华书店正版,关注店铺成为会员可享店铺专属优惠,团购客户请咨询在线客服!
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未来小趋势 浙江人民出版社 新华书店正版,关注店铺成为会员可享店铺专属优惠,团购客户请咨询在线客服!
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Product Details 基本信息 ISBN-13 书号 9783030734473 Author 作者 Vemuri Ranga Format 版本 平装-胶订 Pages Number 页数 193页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2022-05-26 Product Dimensions 商品尺寸 9.21 x 6.14 x 0.47 Shipping Weight 商品重量 0.70 Language 语种 其它(含多语) Book Contents 内容简介 Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits. Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for
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Product Details 基本信息 ISBN-13 书号 9783030734442 Author 作者 Ranga Vemuri Format 版本 精装 Pages Number 页数 191页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2021-06-15 Language 语种 英语 Book Contents 内容简介 Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits. Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those atta
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