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Product Details 基本信息 ISBN-13 书号 9789813349087 Author 作者 Bindhu Format 版本 精装 Pages Number 页数 807页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2021-03-28 Language 语种 其它(含多语) Book Contents 内容简介 This book includes high-quality papers presented at the International Conference on Communication, Computing and Electronics Systems 2020, held at the PPG Institute of Technology, Coimbatore, India, on 21–22 October 2020. The book covers topics such as automation, VLSI, embedded systems, integrated device technology, satellite communication, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, Internet of Things, precision models, bioinformatics, and healthcare informatics.
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Product Details 基本信息 ISBN-13 书号 9789819941889 Author 作者 V. Bindhu Format 版本 精装 Pages Number 页数 188页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-09-01 Language 语种 其它(含多语) Book Contents 内容简介 The book is a collection of best selected research papers presented at the 6th International Conference on Inventive Material Science Applications (ICIMA 2023) organized by PPG Institute of Technology, Coimbatore, India, during May 11–12, 2023. The book includes original research by material science researchers toward developing a compact and efficient functional elements and structures for micro-, nano-, and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational materi
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Product Details 基本信息 ISBN-13 书号 9789811526114 Author 作者 V. Bindhu Format 版本 精装 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2020-06-30 Language 语种 英语 Book Contents 内容简介 This book includes high impact papers presented at the International Conference on Communication, Computing and Electronics Systems 2019, held at the PPG Institute of Technology, Coimbatore, India, on 15-16 November, 2019. Discussing recent trends in cloud computing, mobile computing, and advancements of electronics systems, the book covers topics such as automation, VLSI, embedded systems, integrated device technology, satellite communication, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, Internet of Things, precision models, bioinformatics, and healthcare informatics.
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Product Details 基本信息 ISBN-13 书号 9789811643200 Author 作者 V. Bindhu Format 版本 精装 Pages Number 页数 null页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2021-10-10 Language 语种 其它(含多语) Book Contents 内容简介 The volume is a collection of best selected research papers presented at the 4th International Conference on Inventive Material Science Applications (ICIMA 2021) organized by PPG Institute of Technology, Coimbatore, India during 14 – 15 May 2021. The book includes original research by material science researchers towards developing a compact and efficient functional elements and structures for micro, nano and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational mater
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【预订】International Conference on Communication, Computing and 国外库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9789813349117 Author 作者 V. Bindhu Format 版本 平装-胶订 Pages Number 页数 835页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2022-03-26 Language 语种 其它(含多语) Book Contents 内容简介 This book includes high-quality papers presented at the International Conference on Communication, Computing and Electronics Systems 2020, held at the PPG Institute of Technology, Coimbatore, India, on 21–22 October 2020. The book covers topics such as automation, VLSI, embedded systems, integrated device technology, satellite communication, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, Internet of Things, precision models, bioinformatics, and healthcare informatics.
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【预订】Proceedings of Fourth International Conference on Invent 国外库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9789811643231 Author 作者 V. Bindhu Format 版本 平装-胶订 Pages Number 页数 821页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2022-10-20 Language 语种 其它(含多语) Book Contents 内容简介 The volume is a collection of best selected research papers presented at the 4th International Conference on Inventive Material Science Applications (ICIMA 2021) organized by PPG Institute of Technology, Coimbatore, India during 14 – 15 May 2021. The book includes original research by material science researchers towards developing a compact and efficient functional elements and structures for micro, nano and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational
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Product Details 基本信息 ISBN-13 书号 9789811943065 Author 作者 V. Bindhu Format 版本 平装-胶订 Pages Number 页数 296页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-10-03 Shipping Weight 商品重量 569 Language 语种 其它(含多语) Book Contents 内容简介 The book is a collection of best selected research papers presented at the 5th International Conference on Inventive Material Science Applications (ICIMA 2022) organized by PPG Institute of Technology, Coimbatore, India, during May 6–7, 2022. The book includes original research by material science researchers toward developing a compact and efficient functional elements and structures for micro-, nano-, and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic material
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【预订】Proceedings of Third International Conference on Communi 国外库房发货,通常付款后3-5周到货!
Product Details 基本信息 ISBN-13 书号 9789811688614 Author 作者 V. Bindhu Format 版本 精装 Pages Number 页数 1015页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2022-03-01 Language 语种 其它(含多语) Book Contents 内容简介 This book includes high quality research papers presented at the International Conference on Communication, Computing and Electronics Systems 2021, held at the PPG Institute of Technology, Coimbatore, India, on 28-29 October 2021. The volume focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of Things, cyber-physical systems, and healthcare informatics.
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图书信息 书号: 9789811526114 作者: V Bindhu 装帧: 精装 页数: 757页 出版社: Springer 尺寸: 0.9 x 0.6 x 0.2 cm 出版日期: 2020-03-05 重量: 3g 语种: 其它(含多语) 内容简介 This book includes high impact papers presented at the International Conference on Communi
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Product Details 基本信息 ISBN-13 书号 9789811977527 Author 作者 V. Bindhu Format 版本 精装 Pages Number 页数 1146页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2023-01-11 Language 语种 其它(含多语) Book Contents 内容简介 This book includes high-quality research papers presented at the Fourth International Conference on Communication, Computing and Electronics Systems (ICCCES 2022), held at the PPG Institute of Technology, Coimbatore, India, on September 15–16, 2022. The book focuses mainly on the research trends in cloud computing, mobile computing, artificial intelligence and advanced electronics systems. The topics covered are automation, VLSI, embedded systems, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, communication networks, Internet of things, cyber-physical systems and healthcare inf
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Product Details 基本信息 ISBN-13 书号 9789811526145 Author 作者 Bindhu Format 版本 平装-胶订 Pages Number 页数 757页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2021-05-03 Language 语种 英语 Book Contents 内容简介 This book includes high impact papers presented at the International Conference on Communication, Computing and Electronics Systems 2019, held at the PPG Institute of Technology, Coimbatore, India, on 15-16 November, 2019. Discussing recent trends in cloud computing, mobile computing, and advancements of electronics systems, the book covers topics such as automation, VLSI, embedded systems, integrated device technology, satellite communication, optical communication, RF communication, microwave engineering, artificial intelligence, deep learning, pattern recognition, Internet of Things, precision models, bioinformatics, and healthcare informatics.
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海外直订Proceedings of Fourth International Conference on Invent
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Product Details 基本信息 ISBN-13 书号 9789811943034 Author 作者 V. Bindhu Format 版本 精装 Pages Number 页数 328页 Publisher 出版社 Springer Berlin Heidelberg Publication Date 出版日期 2022-09-02 Language 语种 其它(含多语) Book Contents 内容简介 The book is a collection of best selected research papers presented at the 5th International Conference on Inventive Material Science Applications (ICIMA 2022) organized by PPG Institute of Technology, Coimbatore, India, during May 6–7, 2022. The book includes original research by material science researchers toward developing a compact and efficient functional elements and structures for micro-, nano-, and optoelectronic applications. The book covers important topics like nanomaterials and devices, optoelectronics, sustainable electronic materials, nanocomposites and nanostructures, hybrid electronic materials, medical electronics, computational material
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